KLA Corp at JPMorgan Tech/Auto Forum (Virtual) Transcript
Thank you for attending JPMorgan's 19th annual virtual CES Technology Forum. My name is Harlan Sur, Semiconductor and Semiconductor Capital Equipment Analyst. Very pleased to have Oreste Donzella, Executive Vice President of KLA's Electronics Packaging and Components Division, EPC. This includes specialty semiconductor processing equipment, printed circuit board processing and an inspection, component inspection and display inspection and test. This segment provides great diversification alongside KLA's Semiconductor process control business. Oreste will take us through KLA's EPC segment and how every product line in this division is key to enabling next-generation technologies, such as 5G, next-gen compute architectures, like AI, IOT, touches the automotive markets as well. And then after his presentation, we'll follow it up with questions.
So Oreste, thank you very much for joining us today, and let me turn it over to you.
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