Taiwan Semiconductor Manufacturing Company (TSM, Financial) saw its stock rise by 1.1%, reaching $193.35. According to a recent Trendforce report, the increasing demand for AI applications is driving up the need for customized chips and packaging. This surge is expected to significantly boost the CoWoS (Chip-on-Wafer-on-Substrate) market by 2025.
Next year, TSM's CoWoS market is anticipated to experience considerable growth. NVIDIA's demand for TSM's CoWoS technology is projected to account for nearly 60% of the total, pushing TSM's monthly CoWoS production capacity to almost double, reaching between 75,000 to 80,000 units by the end of the year.
This development highlights TSM's strategic positioning to capture the growing AI market, which continues to expand rapidly due to increasing technological integration across industries.
