Techbond Group Bhd

XKLS:5289 (Malaysia)  
RM 0.37 (+1.37%) Nov 29
13.21
P/B:
1.09
Market Cap:
RM 253.05M ($ 56.93M)
Enterprise V:
RM 225.22M ($ 50.67M)
Volume:
492.00K
Avg Vol (2M):
796.35K
Trade In:
Volume:
492.00K
Avg Vol (2M):
796.35K

Business Description

Description
Techbond Group Bhd is an investment holding company and is engaged in the provision of management services to its subsidiaries. Its segment involved in Industrial Adhesives & Sealants, Supporting products and services, and Chemical. A substantial part of the revenue is generated from Industrial adhesives and sealants segment. The company operates in various geographical locations namely Malaysia, Vietnam, Thailand, Indonesia, China and others with majority of the revenue being generated from its operations in Vietnam.

Financials

XKLS:5289's 30-Y Financials
Income Statement Breakdown FY
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Cashflow Statement Breakdown
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Historical Operating Revenue by Business Segment

Historical Operating Revenue by Geographic Region

5-Step DuPont Analysis as of
No Enough Data

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Peter Lynch Chart

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Performance

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Annualized Return %  

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Techbond Group Bhd Executives

Details

Valuation Chart

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Analyst Estimate

Key Statistics

Name Value
Revenue (TTM) (Mil RM) 151.098
EPS (TTM) (RM) 0.028
Beta 0.48
Volatility % 39.28
14-Day RSI 29.71
14-Day ATR (RM) 0.010063
20-Day SMA (RM) 0.39525
12-1 Month Momentum % -6.9
52-Week Range (RM) 0.365 - 0.585
Shares Outstanding (Mil) 683.93

Piotroski F-Score Details

Year:
Component Result
Piotroski F-Score 7
Positive ROA
Positive CFROA
Higher ROA yoy
CFROA > ROA
Lower Leverage yoy
Higher Current Ratio yoy
Less Shares Outstanding yoy
Higher Gross Margin yoy
Higher Asset Turnover yoy

Techbond Group Bhd Filings

Filing Date Document Date Form
No Filing Data

Techbond Group Bhd Stock Events

Financials Calendars
Event Date Price(RM)
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Techbond Group Bhd Frequently Asked Questions

What is Techbond Group Bhd(XKLS:5289)'s stock price today?
The current price of XKLS:5289 is RM0.37. The 52 week high of XKLS:5289 is RM0.59 and 52 week low is RM0.37.
When is next earnings date of Techbond Group Bhd(XKLS:5289)?
The next earnings date of Techbond Group Bhd(XKLS:5289) is .
Does Techbond Group Bhd(XKLS:5289) pay dividends? If so, how much?
The  Dividend Yield %  of Techbond Group Bhd(XKLS:5289) is 6.08% (As of Today), Highest Dividend Payout Ratio of Techbond Group Bhd(XKLS:5289) was 0.46. The lowest was 0.22. And the median was 0.29. The  Forward Dividend Yield % of Techbond Group Bhd(XKLS:5289) is 6.08%. For more information regarding to dividend, please check our Dividend Page.

Press Release

Subject Date
No Press Release